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(IT-NEWSWIRE.COM, September 08, 2015 ) Portland, OR --
The Global Failure Analysis Market is accounted for $4.51 billion in 2014 and is expected to reach $8.3 billion by 2022 to grow at a CAGR of 7.95%. The Failure Analysis is to analyze the root cause of failure, problems in design issues, assembly issues and silicon issues. Some of the key drivers include industrial advancement and increasing Applications of Failure Analysis. High Equipment and maintenance cost are the restraint factors for the growth of market.
Global Failure Analysis Market is segmented by Technology, by Equipment, by Applications, and by Geography. Depending on the Technology, market is segregated into Broad ion milling (BIM), Focused ion beam (FIB), Reactive ion etching (RIE), Secondary ion mass spectroscopy (SIMS), Energy dispersive X-ray spectroscopy (EDX) and Chemical mechanical planarization (CMP). Based on Equipment, market is classified into Transmission electron microscope (TEM), Focused ion beam system (FIB), Scanning electron microscope (SEM) and Dual - Beam (FIB/SEM). Based on Application, market is categorized into Bio Science, Material Science, Industrial & Electronics, Fiber optics, Nanotechnology, nonmaterial’s and Polymers. Failure Analysis market by geography is segmented into North America, Europe, Asia Pacific and Rest of the World.
The Key players in the market include, JEOL, Ltd., FEI Company, Tescan, Hitachi High- Technologies, Carl Zeiss SMT GmbH, EAG (Evans Analytical Group) Inc., Motion X Corporation, Intertek Group Plc, A&D Company Ltd.
What our report offers:
- Market share assessments for the regional and country level segments
- Market share analysis of the top industry players
- Strategic recommendations for the new entrants
- Market forecasts for a minimum of 8 years of all the mentioned segments, sub segments and the regional markets
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Report Enquiry @ http://www.bigmarketresearch.com/report-enquiry/325772
Table of Contents
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Research Scope
2.3 Research Methodology
2.4 Research Sources
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Failure Analysis Market, By Technology
5.1 Broad ion milling (BIM)
5.2 Focused ion beam (FIB)
5.3 Reactive ion etching (RIE)
5.4 Secondary ion mass spectroscopy (SIMS)
5.5 Energy dispersive X-ray spectroscopy (EDX)
5.6 Chemical mechanical planarization (CMP)
6 Global Failure Analysis Market, By Equipment
6.1 Transmission electron microscope (TEM)
6.2 Focused ion beam system (FIB)
6.3 Scanning electron microscope (SEM)
6.4 Dual - Beam (FIB/SEM)
7 Global Failure Analysis Market, By Application
7.1 Bio Science
7.2 Material Science
7.3 Industrial & Electronics
7.4 Fiber optics
7.5 Nanotechnology and nanomaterials
7.6 Polymers
8 Global Failure Analysis Market, By Geography
8.1 North America
8.2 Europe
8.3 Asia Pacific
8.4 Rest of the World
9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies
10 Company Profiling
10.1 JEOL, Ltd.
10.2 FEI Company
10.3 Tescan
10.4 Hitachi High- Technologies
10.5 Carl Zeiss SMT GmbH
10.6 EAG (Evans Analytical Group) Inc.
10.7 Motion X Corporation
10.8 Intertek Group Plc
10.9 A&D Company Ltd.
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Big Market Research
James Jordan
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james@bigmarketresearch.com
Source: EmailWire.Com 
Source: EmailWire.com
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