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Home | Search Global IT News: IT News & Press Release Distribution: 3D Semiconductor Packaging Market 2016 Trends, Growth, Analysis and Forecasts (IT-NEWSWIRE.COM, January 27, 2017 ) Recent technology advances along with improved durability, reduced energy consumption, superior performance, enhanced quality, and highly efficient features of 3D semiconductor packaging equipment are making this equipment attractive packaging proposition in the semiconductor industry, especially in the consumer electronics industry. The increasing demand for consumer electronics is expected to increase the revenue of the global 3D semiconductor packaging market during the forecast period. Publisher's analysts forecast the global 3D semiconductor packaging market to grow at a CAGR of 16.27% during the period 2016-2020. For more information about this report: http://www.reportsweb.com/global-3d-semiconductor-packaging-market-2016-2020 Covered in this report The report covers the present scenario and the growth prospects of the global 3D semiconductor packaging market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of 3D semiconductor packaging equipment to semiconductor component manufacturers. The market is divided into the following segments based on geography: - Americas - APAC - EMEA Publisher's report, Global 3D Semiconductor Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. Key vendors - Amkor Technology - SUSS Microtek - EV Group - Tokyo Electron Request Sample Copy at http://www.reportsweb.com/inquiry&RW0001303240/sample Other prominent vendors - ACCRETECH Tokyo Seimitsu - Rudolph Technologies - SEMES - Ultratech - ULVAC Market driver - Need to control chip design costs - For a full, detailed list, view our report Market challenge - High capital investment in 3D semiconductor packaging - For a full, detailed list, view our report Market trend - Short replacement cycle of portable electronic devices - For a full, detailed list, view our report Inquire for Report at http://www.reportsweb.com/inquiry&RW0001303240/buying ReportsWeb.com Priya Sisodia +1-646-491-9876 sales@reportsweb.com Source: EmailWire.Com Source: EmailWire.com

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