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(IT-NEWSWIRE.COM, August 18, 2018 ) This report studies the Electronic Packaging Materials market.
Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.
Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
In 2017, Global Electronic Packaging Materials total market size was 4885.6 Million USD, with a steady growth in recent years, according to QYR analysis, the market is expected to reach 6104.9 Million USD by the end of 2023. One of the salient features of Electronic Packaging Materials market is the cooperation with downstream Semiconductor & IC and PCB manufactures, especially for large companies in this industry.
Geographically, the consumption market is leading by Greater China and United States, Europe and Japan. In terms of year 2017, Greater China holds the largest market share, with about 1975.5 Million USD sales revenue, followed by United States, with about 14.76% market share in 2017. China will keep playing important role in Global market.
Over the next five years, LPI(LP Information) projects that Electronic Packaging Materials will register a 3.6% CAGR in terms of revenue, reach US$ 6050 million by 2023, from US$ 4890 million in 2017.
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This report presents a comprehensive overview, market shares, and growth opportunities of Electronic Packaging Materials market by product type, application, key manufacturers and key regions.
To calculate the market size, LP Information considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Metal Packages
Plastic Packages
Ceramic Packages
Segmentation by application:
Semiconductor & IC
PCB
Others
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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
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Some Point from TOC:
1 Scope of the Report
2 Executive Summary
3 Global Electronic Packaging Materials Drivers by Players
4 Electronic Packaging Materials Drivers by Regions
5 Americas
6 APAC
7 Europe
….Continued
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